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Lattice provides customers with low cost and low power programmable solutions that are ready-to-use right out of the box. For the wireless space, a full suite of tested solutions are available that include:
- FPGAs with Embedded SERDES compliant to CPRI, OBSAI, Serial RapidIO and JESD204 standards.
- FPGAs with I/O to Support High-Speed Parallel Interfaces Found on Data Conversion Devices.
- FPGAs with Embedded, High Performance DSP blocks.
- A Portfolio of Soft IP Cores and reference designs.
- Application Specific Development Boards and Demonstration Designs
- Test and Interoperability Reports for PMA, PCS and Generic I/O.
- Cooperation with leading ASSP Vendors and Intellectual Property (IP) Partners to Promote Joint System Solutions
LatticeECP3 & LatticeECP2M: Industry Leading Programmable Wireless Platforms
| Low Cost Digital SERDES |
- Ideal for low cost chip-chip and small factor backplane applications
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| Up to 16 Channels per Device |
- Supports a wide variety of CPRI and OBSAI topologies
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| Very Low Power |
- ECP3: 110mw Per Channel (Typical @ 3.2Gbps)
- ECP2M: 87mW Per Channel (Typical @ 2.5Gbps)
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| Low Cost, High Performance FPGA Fabric |
- High Performance DSP blocks
- ECP3 enhancements:
- Dual-slice architecture with cascadability for filter chains
- Ternary add stage for improved performance
- High Performance I/O
- ECP3 enhancements:
- High Density Embedded Block Ram (EBR)
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| Low Cost, Small Form Factor Package |
- Proven 17x17 wirebond packages for SERDES based FPGAs
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| Complete End to End Solution |
- Soft IP implementations for connectivity and RF/BB processing applications
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Learn more about LatticeECP3 & LatticeECP2M
RRH Solutions Using LatticeECP3 FPGA Family
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Click here to:
- Watch a Demonstration of the RRH Solution
- Download Product Briefs
- Learn about the RRH Solution
- Evaluate the LatticeECP3 FPGA
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Intellectual Property: Rich Portfolio of Soft IP and Reference Designs
Lattice provides a comprehensive portfolio of soft and hard wireless IP including Connectivity support. Also available are reference designs in support of data conversion as well as other signal processing functionality. By targeting the LatticeECP3 and LatticeECP2M platforms, developers will drastically reduce cost, power and footprint over competitive solutions.
Development Boards and Demonstration Designs
Lattice Development Kits combine application specific evaluation boards, IP and relevant reference designs in one comprehensive package. The Solution Kits allow a potential user to quickly and seamlessly evaluate the Lattice Wireless Solutions portfolio, and to use it as a basis for customer specific development.
Wireless Evaluation Boards
| Family |
Board |
Connectors and Capabilities |
| LatticeECP3 |
Serial Protocol Board |
SMAs,CPRI/OBSAI, PCIe, GbE, DDR2/DDR3 (components) |
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I/O Protocol Board |
ADC/DAC, SPI4.2, DDR3 (two DIMMS) |
| LatticeECP2M |
Advanced Evaluation Board |
mico32, SPI4.2, DDR2 SODIMM, ADC/DAC |
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SERDES Evaluation Board |
SMAs, CPRI/OBSAI, PCI Express (x1), SFP, DDR
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Wireless Demos
| LatticeECP3 |
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Electrical (PMA) Testing
To ensure compliance to 1000BaseX standards, we have tested our SERDES Physical Medium Attachment (PMA) to relevant ANSI 11.2 and IEEE802.3 specifications. Testing methdology and results can be found below:
PMA Electrical Characterization
- TN1084 and Supplements (available under NDA) for PCI Express Transmit Jitter Specifications.
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